Focal topic „Imaging the Invisible“ with the latest findings from sensor technology beyond human perception At the European Machine Vision Forum 2025 organized by EMVA, which will take place this year on October 16th and 17th in Fürth, Germany, machine ... read more
Following the successful participation at LogiMAT in 2024 and 2025, the EMVA again offers its members the opportunity of being present at LogiMAT by joining the EMVA Member Booth. Basics: total booth area of 88 sqm common area for ... read more
The ISO working group TC42-WG28 (formerly EMVA 1288) met on June 26th in Berlin. Main topic for the 31 in person as well as virtual attendees was the transfer of the EMVA 1288 text to the ISO online standards development ... read more
When viewed over the long term, the quarterly EMVA market data shows that image processing sales figures in Europe are still well below the peak values recorded in 2022. The analysis of the second quarter of 2025 also displays a ... read more
The inspection of critical infrastructures such as energy plants, bridges or industrial complexes is essential to ensure their safety, reliability and long-term functionality. Traditional inspection methods always require the use of people in areas that are difficult to access or ... Go to article
Seamless integration of 2D/3D and AI Intelligent tool recognition inside the box Automated tool inspection is becoming increasingly important in modern manufacturing. With the Toolfinder, Ziegelbauer offers an intelligent solution for precise tool recognition using AI, deep learning, and 3D ... Go to article
LMI Technologies, in partnership with STT Systems and Stemmer Imaging, implemented an automated quality inspection system to detect missing bolts on automotive blanks. The system integrated multiple Gocator 3D sensors and an RFID tracking system for real-time analysis and traceability. Go to article
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tiny electrical connections between a semiconductor chip and other components. The distances between the bond wires are ... Go to article
